In today’s high-performance world of power electronics — spanning industrial drives, renewable inverters, electric mobility, and consumer systems — true innovation begins with the package.
Performance, reliability, and manufacturability all hinge on how well the device is packaged, cooled, and connected to the system.
At Kaynes Semicon, we blend packaging expertise with simulation-driven design and digital manufacturing workflows to deliver robust, thermally optimized, and scalable solutions for MOSFETs, IGBTs, rectifiers, and power ICs.
We bring legacy-proven reliability and next-generation innovation together — enabling customers to design for both performance and production.
Power Module Packaging Technologies We Support
Our comprehensive portfolio of power semiconductor packaging platforms spans from discrete devices to complex multi-chip modules, built for performance, cost efficiency, and scalability:
Material & Platform Expertise:
Each package is optimized for reliability, thermal performance, and manufacturability, ensuring the ideal balance between cost and efficiency.
Our Design Flow: Where Simulation Meets Silicon
At Kaynes Semicon, packaging isn’t just mechanical design — it’s multi-physics engineering.
We employ a digital-first, simulation-driven flow that bridges the electrical, thermal, and mechanical domains — ensuring every design achieves first-pass success.
Our end-to-end flow includes:
Why Power Electronics OEMs Choose Kaynes Semicon…
We don’t just design packages — we engineer confidence into every layer of your power module.
What Sets Us Apart
Simulation-Driven Innovation – Digital twin validation across all physical domains.
Rapid Prototyping & Scale-Up – Seamless transition from simulation to mass production.
Material Agility – Multiple substrate and interconnect options tailored to performance needs.
Thermal & Reliability Excellence – Optimized for power cycling, thermal fatigue, and high-current operation.
End-to-End Capability – From concept and co-design to DFM validation and production handoff.
Whether you need legacy discrete solutions or high-integration intelligent modules, Kaynes Semicon delivers production-ready, performance-tuned packages engineered for the future of power.
Let’s Power the Future — Together
If you’re designing the next generation of efficient, reliable, and manufacturable power devices, partner with Kaynes Semicon — your trusted ally in power module packaging and system integration.
Connect with our Power Packaging Team to explore co-design opportunities for your next-generation power modules and discrete devices.
