FCCSP offers a low-profile, miniaturized flip-chip solution with high performance in a compact footprint. It’s particularly suited for space-constrained applications such as smartphones, tablets, IoT devices, and wearables.
Advantages of FCCS package
Ultra-Compact Size
Ideal for portable and miniaturized electronics.
Low Profile Height
Enables slim form factors for handheld devices.
Excellent Electrical Performance
Flip-chip connections reduce parasitic inductance.
Good Thermal Efficiency
Die attach and bump connections help dissipate heat.
Cost Efficient
Minimal substrate usage and simple assembly.
Short Interconnect Length
Enhances signal speed and integrity.
Scalable Manufacturing
Easily adapted for high-volume production.
Suitable for High-Density Routing
Supports fine-pitch Inputs-Outputs and complex layouts.
Improved Mechanical Reliabile
Robust under shock, vibration, and bending.
Lead-Free Compatible
Fully compliant with RoHS and green standards.
Integration with RF Modules
Supports integration of antennas or RF front ends.
Flexible Substrate Options
Allows custom substrate tuning for thermal or electrical needs.