MCM packages bring together multiple dies – logic, memory, analog, or RF – into a single, compact package to reduce latency, power consumption, and board space. MCMs are used in applications such as aerospace, high-performance computing (HPC), 5G, and defense.
Advantages of MCM package
High System Integration
Combines multiple dies into one module.
Reduced Interconnect Delay
Faster communication between dies.
Lower Power Consumption
Shorter interconnects reduce overall power usage.
Compact Board Design
Fewer components needed on PCB.
Custom Configuration Options
Supports asymmetric or hybrid die types.
Simplified System Design
Fewer components for easier board layout.
Improved Reliability
Fewer external solder joints and interconnects.
Easier Thermal Management
Centralized heat dissipation.
Cost Reduction at System Level
Reduces total BOM and assembly costs.
Supports Heterogeneous Integration
Combines logic, RF, analog, and memory dies.
Increased Performance per Watt
Efficient data processing in constrained environments.
Ideal for Harsh Environments
Military, aerospace, and telecom ready.