Discover the Kaynes Semicon Advantages
IC packaging is the essential technology that distributes electrical signals from a silicon chip onto the printed circuit board via different types of interconnection methods while provides protection against environmental stresses. A variety of IC packaging technologies is available from Kaynes Semicon to meet numerous end product requirements, including low profile, small foot-print, light weight, efficient thermal dissipation, and better performance in electrical properties and reliability.
Kaynes Semicon partners with customers to provide them with the highest-quality IC assembly services to achieve their goals. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly.
Innovation Leaders
We are at the forefront of packaging innovation, constantly pushing boundaries to bring you the quality product and most advanced solutions.
Quality Assurance
Our rigorous testing processes and commitment to quality assurance ensure that your semiconductor devices meet the highest industry standards.
Collaborative Partnership
Your success is our success. We believe in collaborative partnerships, working closely with you to achieve shared goals and milestones.
Global Reach, Local Commitment
With a global footprint, we seamlessly integrate into the semiconductor supply chain, providing efficient logistics and a reliable production network with a local commitment to your success.
EXPLORE
ELEVATE
EXCEL
QFN – Quad Flat No-leads Packages
Leadless packages offering compactness, thermal efficiency, and versatility for a wide range of applications, with cost-effective manufacturing benefits.
SOT – Small Outline Transistor packages
Compact, surface-mount semiconductor solutions, ideal for space-constrained applications and automated assembly processes.
TO – Transistor Outline Packages
Robust through-hole packages for power semiconductors, featuring high power handling and effective thermal dissipation.
BGA – Ball Grid ArrayPackages
High-density integration with solder ball grid, ideal for microprocessors and memory devices.
FCBGA – Flip Chip Ball Grid Array Packages
Enhanced electrical performance and compact size with flip chip technology, suitable for graphics processors and data centers.
FCCSP – Flip Chip Chip Scale Package
Compact chip scale package with flip chip technology, ideal for miniaturized electronics and mobile devices.
MCM – Multi-chip module Package
Compact multi-chip module for high-performance computing and telecommunications.
SIP – System in Package Solutions
Integration of multiple components for simplified system integration, perfect for IoT devices and wireless communication systems.
Co-Packages Optics
Optical components integrated within a single package, ideal for high-speed data transmission and telecommunications applications.