Co-Packaged Optics integrates optical engines alongside switching silicon in the same package or module. It addresses the need for high-bandwidth, low-power, and low-latency interconnects in AI clusters, hyperscale data centers, and future networking gear.
Advantages of CPO
Massive Bandwidth Density
Delivers tens to hundreds of Tbps in a compact form.
Lower Total Power Consumption
Reduces energy lost to electrical interconnects.
Minimized Latency
Proximity of electrical and optical domains reduces delays.
High Signal Integrity
Optical signals are immune to electromagnetic interference.
Reduced Thermal Load on Switch ASIC
Partitioned thermal zones improve efficiency.
Compact Rack Integration
Enables higher port density per RU.
Improves Cooling Efficiency
Optimized airflow and thermal design.
Supports AI and ML Workloads
Handles high-throughput, parallel processing.
Enables Disaggregated Architectures
Separates compute from I/O functions.
Future-Proof Scalability
Readiness for next-gen switch ASICs and protocols.
Integration with Silicon Photonics
Monolithic or hybrid photonics compatibility.
Meets Hyperscale and Edge Needs
Essential for modern network and compute scaling.