System in Package (SiP) technology combines several ICs and passive components into one miniaturized, functional system. SiPs reduce time-to-market, size, and complexity – ideal for smart devices, IoT modules, and wearables.
Advantages of SiP
All-in-One Functionality
Incorporates processors, memory, sensors, and power.
Miniaturization
Dramatically reduces board space.
Supports 2.5D/3D Stacking
Enables vertical integration of dies.
Faster Time to Market
Modular approach simplifies development.
Design Flexibility
Supports mixed-signal, RF, and digital logic.
Optimized Power Usage
Enables low-power designs for mobile use.
Improved System Performance
Reduced latency among components.
Thermal Optimization
Centralized heat control across integrated components.
Customizable for Specific Applications
Tailored to end-use cases.
Enables Edge Computing
Integrates compute, storage, and communication.
Ideal for IoT and Medical Devices
Compact and power-efficient.
Lower System Cost
Fewer external components and reduced assembly steps.