System Solution Group (SSG)

What we do?

From Innovation to Realization- We at SSG enable our customer’s ideated concept to the Product realization. We bring to the table a cutting edge technology with high caliber engineers who transform these concepts through end-to-end system design and development.

Key Technologies

Systems Hardware Design & Test Solution Development

FPGA RTL – Design & Development

Semiconductor Package design and prototyping

Layout Design & Simulations engineering

Software Design & Development

Key Domain Expertise: An end-to-end solutions provider

  • Fabrication and OSAT Management
  • Package Design
  • ATE Test & Characterization
  • Reliability Qualification
  • System Level Test Low volume / Pilot run production
  • System Architecture – HW & SW
  • System Hardware/ Software / FPGA FW design
  • Test Bench Development
  • Qualification against standards
  • Pre-compliance Test
  • Productization

High Calibre Package & PCB Design / Simulation / DFM / CAM Validation -> Volume Manufacturing

System Hardware Design Capabilities

1. Test Engineering Activities

TE board designs and Test HW.

  • Bench Test Hardware Development
  • Characterization and Automation
  • Diagnostic SW for System Level Testing
  • Automated Test Equipment (ATE) hardware development for Full Test, Leakage, Continuity etc.,
  • Test Program meant for newly designed Silicon & for volume production

2. Quality System Boards

In collaboration with Packaging & PCB Design experts

3. High Level expertise

  • Characterization and Validation of new Silicons
  • Specification to Productization including Compliance testing
  • High speed Interfaces (PCIe, DDR, LPDDR, SGMII, RGMII, CXL, MIPI – CSI and DSI)
  • Industry popular FPGA technology based designs
  • Design of high-voltage boards with battery management systems
  • Full Qual support – EVT, PVT, DVT and Thermal stress requirement
  • Design compliance for MIL, JSS and DO standards
  • Product compliance testing including Thermal cycling, Thermal shock and vibration

4. Device/Board level Characterization and validation

  • Measurement of Electrical Parameters: Rise time, Fall time, VIH, VIL, VOH, VOL
  • Clock measurement – Jitter, Overshoot, Undershoot, Rise & Fall time
  • Device performance across PVT using Thermal Management System
  • Automation framework for recurring measurements across PVT
  • High Speed Transceiver validation using BERT & measurement of Eye-pattern
  • Power Sequence, Ripple, Load and Line regulation, Transient response, Load Test using Digital Electronic Load

1. Design of Packages & complex PCBs

  • Package design 2.0D, 2.5D and 3.0D technologies
  • Stack-up: Multi-layer HDI with Blind and buried vias
  • Impedance Controlled Designs – Megatron 6, 7N, Rogers, EM890
  • Board Thickness: Ranges from 1mm
  • Board Size: Based on ATE form factor / End Application Requirement
  • High Speed Interfaces
  • Routing: QSFP, PCIE, Different types of DDR interfaces like UDIMM, SODIMM, RLD RAM, QDR and CLAM Shell
  • High density Component design
  • Design of Increased layer count and thickness with drill size as low as 4mil

2. Simulation capabilities

  • Signal integrity – IL, RL, LCR Extraction and Eye-pattern
  • Power integrity – IR drop, AC simulation and DC coupling
  • Thermal Analysis – Board Level, Module Level and System Levels
  • Structural Simulation
  • EMI/EMC Analysis – RE, CE, RS and CS

Package & PCB Design Capabilities

System Software Capabilities

1. HAL SW & Middleware Development

  • U-Boot customization (optimized boot time)
  • BSP development & Porting
  • Linux, Android, WinCE and RTOS platforms
  • HW Platforms – ARM / PowerPC / x86, Industry popular FPGA+SOC etc.,
  • Middleware for Multimedia, Graphics, Connectivity and File systems
  • Firmware for DSP, FPGA programming

2. Application SW Development

  • Test Application SW – Functional Testing / System Level Testing
  • Multiple HD video streams encode and decode
  • Plugins for hardware and software codecs
  • Integration of wide range of AV codecs on TI DSM, ARM & x86 Processors
  • H.265/HEVC, H.264, H.263, VC-1, MPEG-4, MJPEG
  • Network streaming with RTP, HTTP, TCP, UDP, IGMP, FTP protocols
  • Customization (Framework, UI level) for Android, QT and UI development using NXPPEGPRO

3. FPGA RTL Design Capabilities

  • FPGA based design & HDL Coding (VHDL / Verilog)
  • Industry popular FPGAs / SOCs from Xilinx, Intel, Lattice and Microsemi etc.
  • FPGA platforms and tools =>realization of high complex FPGA-based systems.
  • Design / Develop & Integrate different types of interfaces
  • JESD standard – High Speed Data Converters (ADC’s & DAC’s)
  • Memories(DDR2,DDR3,DDR4), SRAM, EEPROM / Flash.
  • Ethernet, HDMI, CAMLINK Transceiver, PCIe,
  • SDI,SDH,RS232,RS422,RS485 etc.